Red-hot air gun is one of the most frequently used tools in phone repair and the technical requirements concerning technicians are also very high Both soldering and desoldering of motherboard ingredients require a hot air gun Today we will walk you through some basic knowledge of hot air gun in telephone mend In the first place, let’s take a look at the type of hot air gun Hot air gun can be divided into helical wind type and horizontal hurricane nature Helical wind type is mainly used to solder and desolder connector, NAND, CPU, WiFi module and other relatively large chips Vertical wind type is mainly used to solder and desolder small components like resistor, capacitor, etc.The helical air character pieces gentle airflow and low-grade hot while horizontal hurricane character has centralized airflow and high-pitched heat Proper use of the hot air gun can enhance repair efficiency while incorrect use can detriment the phone The temperature and airflow of the hot air gun are required to comply with special requirements in different scenarios The component can’t be removed or soldering is likely to be flawed if the temperature is set too low while components and PCB board will be damaged under high temperature What’s more, ingredients will get blown away if the airflow is set too high Therefore, proper use of the hot air gun is the key to phone repair Then we will show you how to use hot air gun properly for telephone restore First of all, let’s take a look at how to desolder small components Vertical wind hot air gun is used to desolder these kinds of components The temperature shall be established around 330 C-3 65 C and airflow around 1-3 Because the horizontal hurricane hot air gun heats up so quickly, please wait to begin working until the temperature is stable after starting up In addition, the nozzle should be kept horizontal from the component with a distance of 3-6 mm You should heat evenly above the ingredient for about 13 -1 8 seconds Then remove the component with tweezers For soldering, the soldering programme is the same as the desoldering programme You need to made the factor in position firstly and pay attention to the temperature as well as airflow Next, let’s see how to desolder sizable chippings with hot air gun Corner adhesive needs to be removed when we use hot air gun to desolder huge chippings like NAND Helical wind hot air gun is used to desolder these kinds of large-scale chips Please apply high-temperature tape around the component to protect surrounding ingredients The temperature should be set around 365 C-4 00 C and airflow around 45 -6 5 The nozzle should be kept horizontal from the ingredient with great distances of 6-8 mm You should heat evenly above the component for about 40 seconds Then pry up the component with a crowbar blade In summing-up, the nozzle of hot air gun should be kept horizontal from the soldering surface with a suitable distance Other than that, the temperature and airflow of the hot air gun must be positioned properly according to the actual repair circumstances Please note that the temperature sometimes has to be adjusted according to the type of fixture The synthetic stone fixture vanishes hot gradually, and the temperature can be lower The iron fixture vanishes hot soon, and the temperature should be set higher Most motherboard mends will be implemented by a hot air gun Choosing the right one will meet your repair easier with high efficiency Two in one hot air gun has always been a hot-selling product in the phone repair industry REWA Selected recommends the 2 in 1 SUGON 8620 hot air gun to you The hot air gun heats up quickly with several nozzles You can easily switch between helical and horizontal air directly by changing the nozzle to achieve different application situations Besides that, its pattern is also very user-friendly, easy to use, and easy to lieu You can purchase SUGON 8620 Hot Air Gun from REWA shop Please feel free to leave your thoughts on the appropriate use of a hot air gun for phone repair in the comment section Thank you for watching
